MPS是查普曼仪器公司的用于表面测量和分析，它既可以用作在线质量检查的生产工具，也可以用作建立标准和研究公差的研发工具。采用非接触测量技术，用户可以快速进行高分辨率线性或圆形扫描。基于Windows®的操作软件可以通过编程来执行一系列例行程序，并报告在线生产数据以供进一步分析。用于高品质200mm和300 mm晶圆。非接触式激光检测系统，可实现晶圆360度检测，包括表面(Surface Waviness, Surface Roughness )及边的粗糙度检测(front/back side, front/back bevel apex)。可选配识别Notch、Roll Off 。可根据需要选择自动和手动机型。
Non-contact measurements at any location
Two million data points in a single scan (front/back side, front/back bevel apex)
360 degrees circular measurements any surface including edge
Capability for polished and/or roughed wafers both planar and edge
Automated Objective Changer
Unique automated edge measurements
3D Topography Scanning
Cost-effective
Significantly higher data quality
Increased process data
Higher productivity
Hand-off operation
No vibration impact on measurements
Increase yield
Roughness parameters:Ra,Rq,Rp,Rv,Rpm,Rvm,Rt,Rz,Rsk,Rku,and more
Waviness parameters:Wa,Wq,Wp,Wy,Wt
Other parameters:Histogram,cumulative distribution,Power spectrum,slope,etc.
Programmable cutoff filter:Conforms to SEMI,ANSI B46.1 and ISO standards
Performance Specifications：Vertical resolution: 0.01 nm
Horizontal resolution: 0.5 μm
Linear scan length: Up to 100 mm
Circular scan Length: Complete circumference of wafer Fine data sampling 50 nm (minimum)