抛光机类 切割机类 研磨机类 贴膜机类
无尘室通用类 无尘室周转类
1st Optical Inspection Wafer IQC
晶圆表面检测及晶圆厚度测量设备
Tape Laminator
贴膜机
Grinding Back Side Grinder
研磨/抛光设备
2nd Optical Inspection Pre/Post Dicing Inspection
二光检设备
Wafer Mount Tape Laminator
Dicing
切割设备
C02
纯水系统
Wafer cleaning Wafer Cleaning
晶圆清洗机
Expander Wafer Expansion
扩片设备
UV Curing UV Tape Curing
解胶机
3rd Optical Inspection Post Wire Bond Inspection
三光检设备
